{"created":"2023-05-15T12:20:52.778738+00:00","id":11594,"links":{},"metadata":{"_buckets":{"deposit":"1a2ec7cc-df69-41b6-80ae-140b8e6a4dc7"},"_deposit":{"created_by":1,"id":"11594","owners":[1],"pid":{"revision_id":0,"type":"depid","value":"11594"},"status":"published"},"_oai":{"id":"oai:kansai-u.repo.nii.ac.jp:00011594","sets":["528:1588:1595:1597"]},"author_link":["27482","27486","27479","27483","27481","27480","27485","27484"],"item_9_alternative_title_20":{"attribute_name":"その他のタイトル","attribute_value_mlt":[{"subitem_alternative_title":"Pulsed Electric-Current Bonding of SiC to Cu with Ti Intermediate Layer"}]},"item_9_biblio_info_7":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2003-09","bibliographicIssueDateType":"Issued"},"bibliographicIssueNumber":"9","bibliographicPageEnd":"435","bibliographicPageStart":"432","bibliographicVolumeNumber":"67","bibliographic_titles":[{"bibliographic_title":"日本金属学会誌"}]}]},"item_9_description_4":{"attribute_name":"概要","attribute_value_mlt":[{"subitem_description":"The bonding of SiC (pressureless-sintered silicon carbide) and Cu (oxygen-free copper) with a Ti intermediate layer was\ncarried out using pulsed electric-current sintering. The influences of the intermediate layer on the bond strength and the microstructure\nof the joint were then investigated by SEM and TEM observations. The bonding conditions were varied between 923-1173 K for 1.8-3.6 ks under a constant bonding pressure of 24 MPa. The bond strength of SiC to Cu with a Ti intermediate layer showed marked improvement, whereas the direct bonding without an intermediate layer resulted in the separation of SiC from the\nCu specimen immediately after the bonding operation without any application of external load. TEM observations of the joint interface\nwith the Ti intermediate layer revealed that a TiC layer ～300 nm thick and a Cu solid-solution layer ～70 nm thick had\ncovered most of the interface, with the Cu layer formed between the TiC layer and the SiC matrix.","subitem_description_type":"Other"}]},"item_9_description_5":{"attribute_name":"内容記述","attribute_value_mlt":[{"subitem_description":"平成14年度関西大学学術研究助成基金","subitem_description_type":"Other"}]},"item_9_full_name_3":{"attribute_name":"著者別名","attribute_value_mlt":[{"nameIdentifiers":[{"nameIdentifier":"27483","nameIdentifierScheme":"WEKO"}],"names":[{"name":"Nishimoto, Akio"}]},{"nameIdentifiers":[{"nameIdentifier":"27484","nameIdentifierScheme":"WEKO"}],"names":[{"name":"Nakao, Kazuyoshi"}]},{"nameIdentifiers":[{"nameIdentifier":"27485","nameIdentifierScheme":"WEKO"}],"names":[{"name":"Akamatsu, Katsuya"}]},{"nameIdentifiers":[{"nameIdentifier":"27486","nameIdentifierScheme":"WEKO"}],"names":[{"name":"Ikeuchi, Kenji"}]}]},"item_9_publisher_34":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"日本金属学会"}]},"item_9_relation_12":{"attribute_name":"DOI","attribute_value_mlt":[{"subitem_relation_type":"isIdenticalTo","subitem_relation_type_id":{"subitem_relation_type_id_text":"10.2320/jinstmet1952.67.9_432","subitem_relation_type_select":"DOI"}}]},"item_9_rights_13":{"attribute_name":"権利","attribute_value_mlt":[{"subitem_rights":"© 2003 The Japan Institute of Metals"}]},"item_9_source_id_10":{"attribute_name":"書誌レコードID","attribute_value_mlt":[{"subitem_source_identifier":"AN00062446","subitem_source_identifier_type":"NCID"}]},"item_9_source_id_8":{"attribute_name":"ISSN","attribute_value_mlt":[{"subitem_source_identifier":"00214876","subitem_source_identifier_type":"ISSN"}]},"item_9_version_type_17":{"attribute_name":"著者版フラグ","attribute_value_mlt":[{"subitem_version_resource":"http://purl.org/coar/version/c_970fb48d4fbd8a85","subitem_version_type":"VoR"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"西本, 明生"}],"nameIdentifiers":[{},{}]},{"creatorNames":[{"creatorName":"中尾, 和祺"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"赤松, 勝也"}],"nameIdentifiers":[{},{}]},{"creatorNames":[{"creatorName":"池内, 建二"}],"nameIdentifiers":[{}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2019-05-23"}],"displaytype":"detail","filename":"KU-1100-20030900-00.pdf","filesize":[{"value":"704.8 kB"}],"format":"application/pdf","licensetype":"license_note","mimetype":"application/pdf","url":{"label":"KU-1100-20030900-00.pdf","url":"https://kansai-u.repo.nii.ac.jp/record/11594/files/KU-1100-20030900-00.pdf"},"version_id":"08bced6c-47b4-4aca-971e-f0b72ece6a50"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"放電プラズマ焼結","subitem_subject_scheme":"Other"},{"subitem_subject":"パルス通電接合","subitem_subject_scheme":"Other"},{"subitem_subject":"セラミックス","subitem_subject_scheme":"Other"},{"subitem_subject":"透過電子顕微鏡法","subitem_subject_scheme":"Other"},{"subitem_subject":"セラミックス/金属界面","subitem_subject_scheme":"Other"},{"subitem_subject":"パルス通電焼結","subitem_subject_scheme":"Other"},{"subitem_subject":"interfacial microstructure","subitem_subject_scheme":"Other"},{"subitem_subject":"transmission electron microscopy","subitem_subject_scheme":"Other"},{"subitem_subject":"reactive metal","subitem_subject_scheme":"Other"},{"subitem_subject":"pulsed electric-current sintering","subitem_subject_scheme":"Other"},{"subitem_subject":"bonding","subitem_subject_scheme":"Other"},{"subitem_subject":"silicon carbide","subitem_subject_scheme":"Other"},{"subitem_subject":"titanium","subitem_subject_scheme":"Other"},{"subitem_subject":"spark plasma sintering","subitem_subject_scheme":"Other"},{"subitem_subject":"ceramics","subitem_subject_scheme":"Other"},{"subitem_subject":"ceramics-metal interface","subitem_subject_scheme":"Other"},{"subitem_subject":"関西大学","subitem_subject_scheme":"Other"},{"subitem_subject":"Kansai University","subitem_subject_scheme":"Other"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"jpn"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"journal article","resourceuri":"http://purl.org/coar/resource_type/c_6501"}]},"item_title":"Tiインサート金属を用いたSiCとCuとのパルス通電接合","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"Tiインサート金属を用いたSiCとCuとのパルス通電接合"}]},"item_type_id":"9","owner":"1","path":["1597"],"pubdate":{"attribute_name":"公開日","attribute_value":"2016-10-24"},"publish_date":"2016-10-24","publish_status":"0","recid":"11594","relation_version_is_last":true,"title":["Tiインサート金属を用いたSiCとCuとのパルス通電接合"],"weko_creator_id":"1","weko_shared_id":1},"updated":"2023-05-15T13:35:38.429391+00:00"}