{"created":"2023-05-15T12:20:52.728539+00:00","id":11593,"links":{},"metadata":{"_buckets":{"deposit":"37920b8a-5a04-4431-84ef-7c550b7346f9"},"_deposit":{"created_by":1,"id":"11593","owners":[1],"pid":{"revision_id":0,"type":"depid","value":"11593"},"status":"published"},"_oai":{"id":"oai:kansai-u.repo.nii.ac.jp:00011593","sets":["528:1588:1595:1597"]},"author_link":["27476","27475","27470","27473","27472","27468","27471","27467","27477","27478","27469","27474"],"item_9_alternative_title_20":{"attribute_name":"その他のタイトル","attribute_value_mlt":[{"subitem_alternative_title":"Interfacial Microstructure of SiC/Cu Joint Friction-Bonded with Ti Intermediate Layer"}]},"item_9_biblio_info_7":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2003-10","bibliographicIssueDateType":"Issued"},"bibliographicIssueNumber":"10","bibliographicPageEnd":"546","bibliographicPageStart":"538","bibliographicVolumeNumber":"67","bibliographic_titles":[{"bibliographic_title":"日本金属学会誌"}]}]},"item_9_description_4":{"attribute_name":"概要","attribute_value_mlt":[{"subitem_description":"In order to discuss the effect of a Ti intermediate layer on the strength of the friction-bonded joint of silicon carbide to copper, the microstructure of the joint interface was observed with a TEM. Specimens to be bonded were rods of pressureless-sintered SiC and oxygen-free copper. TEM observations revealed that reaction layers less than a few 10 nm thick were formed, which were identified as Cu, TiC, and Ti5Si3 on the basis of SAD pattern and EDX analyses. The Ti5Si3 layer was partly formed as discrete islands on the Cu side of the TiC layer. The Cu layer was located between SiC matrix and TiC layer, forming TiC/Cu double layers. The TiC/Cu double layers presented preferred orientation relationships with SiC, which can be expressed by the following equations.\n(This article is not displayable. Please see full text pdf.)\nOn the other hand, the Ti5Si3 layer showed no preferred orientation relationship with SiC or Cu. In addition to these reaction layers, amorphous layers of Si oxide ∼100 nm thick were occasionally observed at the SiC/Cu interface. In the Cu-Ti mixing region adjacent to the joint interface, Cu4Ti particles ∼100 nm size in diameter were observed.","subitem_description_type":"Other"}]},"item_9_full_name_3":{"attribute_name":"著者別名","attribute_value_mlt":[{"nameIdentifiers":[{"nameIdentifier":"27473","nameIdentifierScheme":"WEKO"}],"names":[{"name":"Nishimoto, Akio"}]},{"nameIdentifiers":[{"nameIdentifier":"27474","nameIdentifierScheme":"WEKO"}],"names":[{"name":"Ando, Masaaki"}]},{"nameIdentifiers":[{"nameIdentifier":"27475","nameIdentifierScheme":"WEKO"}],"names":[{"name":"Takahashi, Makoto"}]},{"nameIdentifiers":[{"nameIdentifier":"27476","nameIdentifierScheme":"WEKO"}],"names":[{"name":"Aritoshi, Masatoshi"}]},{"nameIdentifiers":[{"nameIdentifier":"27477","nameIdentifierScheme":"WEKO"}],"names":[{"name":"Akamatsu, Katsuya"}]},{"nameIdentifiers":[{"nameIdentifier":"27478","nameIdentifierScheme":"WEKO"}],"names":[{"name":"Ikeuchi, Kenji"}]}]},"item_9_publisher_34":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"日本金属学会"}]},"item_9_relation_12":{"attribute_name":"DOI","attribute_value_mlt":[{"subitem_relation_type":"isIdenticalTo","subitem_relation_type_id":{"subitem_relation_type_id_text":"10.2320/jinstmet1952.67.10_538","subitem_relation_type_select":"DOI"}}]},"item_9_rights_13":{"attribute_name":"権利","attribute_value_mlt":[{"subitem_rights":"© 2003 The Japan Institute of Metals"}]},"item_9_source_id_10":{"attribute_name":"書誌レコードID","attribute_value_mlt":[{"subitem_source_identifier":"AN00062446","subitem_source_identifier_type":"NCID"}]},"item_9_source_id_8":{"attribute_name":"ISSN","attribute_value_mlt":[{"subitem_source_identifier":"00214876","subitem_source_identifier_type":"ISSN"}]},"item_9_version_type_17":{"attribute_name":"著者版フラグ","attribute_value_mlt":[{"subitem_version_resource":"http://purl.org/coar/version/c_970fb48d4fbd8a85","subitem_version_type":"VoR"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"西本, 明生"}],"nameIdentifiers":[{},{}]},{"creatorNames":[{"creatorName":"安藤, 正昭"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"高橋, 誠"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"有年, 雅敏"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"赤松, 勝也"}],"nameIdentifiers":[{},{}]},{"creatorNames":[{"creatorName":"池内, 建二"}],"nameIdentifiers":[{}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2019-05-23"}],"displaytype":"detail","filename":"KU-1100-20031000-00.pdf","filesize":[{"value":"1.7 MB"}],"format":"application/pdf","licensetype":"license_note","mimetype":"application/pdf","url":{"label":"KU-1100-20031000-00.pdf","url":"https://kansai-u.repo.nii.ac.jp/record/11593/files/KU-1100-20031000-00.pdf"},"version_id":"d8ff4d63-2b81-4337-8e47-d4f4f49924a7"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"摩擦圧接","subitem_subject_scheme":"Other"},{"subitem_subject":"界面反応層","subitem_subject_scheme":"Other"},{"subitem_subject":"接合","subitem_subject_scheme":"Other"},{"subitem_subject":"セラミックス","subitem_subject_scheme":"Other"},{"subitem_subject":"silicon carbide","subitem_subject_scheme":"Other"},{"subitem_subject":"copper","subitem_subject_scheme":"Other"},{"subitem_subject":"titanium","subitem_subject_scheme":"Other"},{"subitem_subject":"reactive metal","subitem_subject_scheme":"Other"},{"subitem_subject":"friction bonding","subitem_subject_scheme":"Other"},{"subitem_subject":"reaction layer","subitem_subject_scheme":"Other"},{"subitem_subject":"titanium carbide","subitem_subject_scheme":"Other"},{"subitem_subject":"interfacial microstructure","subitem_subject_scheme":"Other"},{"subitem_subject":"transmission electron microscopy","subitem_subject_scheme":"Other"},{"subitem_subject":"lattice misfit","subitem_subject_scheme":"Other"},{"subitem_subject":"関西大学","subitem_subject_scheme":"Other"},{"subitem_subject":"Kansai University","subitem_subject_scheme":"Other"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"jpn"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"journal article","resourceuri":"http://purl.org/coar/resource_type/c_6501"}]},"item_title":"Tiインサート金属を用いた炭化ケイ素と無酸素銅との摩擦圧接継手の界面構造","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"Tiインサート金属を用いた炭化ケイ素と無酸素銅との摩擦圧接継手の界面構造"}]},"item_type_id":"9","owner":"1","path":["1597"],"pubdate":{"attribute_name":"公開日","attribute_value":"2016-10-24"},"publish_date":"2016-10-24","publish_status":"0","recid":"11593","relation_version_is_last":true,"title":["Tiインサート金属を用いた炭化ケイ素と無酸素銅との摩擦圧接継手の界面構造"],"weko_creator_id":"1","weko_shared_id":1},"updated":"2023-05-15T13:35:40.635769+00:00"}