{"created":"2023-05-15T12:20:48.587541+00:00","id":11506,"links":{},"metadata":{"_buckets":{"deposit":"cbe97db4-7de5-4753-aab0-fd4fa05493ea"},"_deposit":{"created_by":1,"id":"11506","owners":[1],"pid":{"revision_id":0,"type":"depid","value":"11506"},"status":"published"},"_oai":{"id":"oai:kansai-u.repo.nii.ac.jp:00011506","sets":["528:1588:1595:1597"]},"author_link":["26770","26773","26767","26758","26772","26759","26764","26765","26760","26768","26769","26762","26771","26761","26763","26766"],"item_9_biblio_info_7":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2008","bibliographicIssueDateType":"Issued"},"bibliographicIssueNumber":"1","bibliographicPageEnd":"32","bibliographicPageStart":"24","bibliographicVolumeNumber":"15","bibliographic_titles":[{"bibliographic_title":"IEEE Transactions on Dielectrics and Electrical Insulation"}]}]},"item_9_description_4":{"attribute_name":"概要","attribute_value_mlt":[{"subitem_description":"Effects of the differences in the curing agent and filler dispersion method on the dielectric properties were examined for epoxy/clay nanocomposites. Irrespective of the clay dispersion method, relative permittivity and electrical conductivity are higher in the samples cured with the amine. Moreover, negative heterocharge accumulates in the vicinity of the anode in the amine-cured samples, whereas positive homocharge accumulates in the acid anhydride-cured samples. From the results of UV photon absorption and PL measurement, the bandgap or the energy at which the photon absorption increases drastically is smaller in the amine-cured samples than in the acid anhydride-cured samples. Ion migration can occur easily in the amine-cured samples whose electrical conductivity and relative permittivity are higher than the acid anhydride-cured samples. The curing agent gives the strongest effect, while the existence of clay affects secondly and the filler dispersion method has the weakest effect.","subitem_description_type":"Other"}]},"item_9_full_name_3":{"attribute_name":"著者別名","attribute_value_mlt":[{"nameIdentifiers":[{"nameIdentifier":"26766","nameIdentifierScheme":"WEKO"}],"names":[{"name":"田上, 直紀"}]},{"nameIdentifiers":[{"nameIdentifier":"26767","nameIdentifierScheme":"WEKO"}],"names":[{"name":"岡田, 正英"}]},{"nameIdentifiers":[{"nameIdentifier":"26768","nameIdentifierScheme":"WEKO"}],"names":[{"name":"平井, 直志"}]},{"nameIdentifiers":[{"nameIdentifier":"26769","nameIdentifierScheme":"WEKO"}],"names":[{"name":"大木, 義路"}]},{"nameIdentifiers":[{"nameIdentifier":"26770","nameIdentifierScheme":"WEKO"}],"names":[{"name":"田中, 祀捷"}]},{"nameIdentifiers":[{"nameIdentifier":"26771","nameIdentifierScheme":"WEKO"}],"names":[{"name":"今井, 隆浩"}]},{"nameIdentifiers":[{"nameIdentifier":"26772","nameIdentifierScheme":"WEKO"}],"names":[{"name":"原田, 美由紀"}]},{"nameIdentifiers":[{"nameIdentifier":"26773","nameIdentifierScheme":"WEKO"}],"names":[{"name":"越智, 光一"}]}]},"item_9_publisher_34":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"IEEE Dielectrics and Electrical Insulation Society"}]},"item_9_rights_13":{"attribute_name":"権利","attribute_value_mlt":[{"subitem_rights":"IEEE Dielectrics and Electrical Insulation Society, The original publication is available at http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=4446733"}]},"item_9_source_id_10":{"attribute_name":"書誌レコードID","attribute_value_mlt":[{"subitem_source_identifier":"AA10992839","subitem_source_identifier_type":"NCID"}]},"item_9_source_id_8":{"attribute_name":"ISSN","attribute_value_mlt":[{"subitem_source_identifier":"10709878","subitem_source_identifier_type":"ISSN"}]},"item_9_version_type_17":{"attribute_name":"著者版フラグ","attribute_value_mlt":[{"subitem_version_resource":"http://purl.org/coar/version/c_ab4af688f83e57aa","subitem_version_type":"AM"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"Tagami, Naoki"}],"nameIdentifiers":[{"nameIdentifier":"26758","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"Okada, Masahide"}],"nameIdentifiers":[{"nameIdentifier":"26759","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"Hirai, Naoshi"}],"nameIdentifiers":[{"nameIdentifier":"26760","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"Ohki, Yoshimichi"}],"nameIdentifiers":[{"nameIdentifier":"26761","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"Tanaka, Toshikatsu"}],"nameIdentifiers":[{"nameIdentifier":"26762","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"Imai, Takahiro"}],"nameIdentifiers":[{"nameIdentifier":"26763","nameIdentifierScheme":"WEKO"}]},{"creatorAffiliations":[{"affiliationNameIdentifiers":[{"affiliationNameIdentifier":"","affiliationNameIdentifierScheme":"ISNI","affiliationNameIdentifierURI":"http://www.isni.org/isni/"}],"affiliationNames":[{"affiliationName":"","affiliationNameLang":"ja"}]}],"creatorNames":[{"creatorName":"原田, 美由紀","creatorNameLang":"ja"},{"creatorName":"Harada, Miyuki","creatorNameLang":"en"}],"familyNames":[{"familyName":"原田","familyNameLang":"ja"},{"familyName":"Harada","familyNameLang":"en"}],"givenNames":[{"givenName":"美由紀","givenNameLang":"ja"},{"givenName":"Miyuki","givenNameLang":"en"}],"nameIdentifiers":[{"nameIdentifier":"26764","nameIdentifierScheme":"WEKO"},{"nameIdentifier":"50411492","nameIdentifierScheme":"e-Rad","nameIdentifierURI":"https://nrid.nii.ac.jp/ja/nrid/1000050411492"}]},{"creatorAffiliations":[{"affiliationNameIdentifiers":[{"affiliationNameIdentifier":"","affiliationNameIdentifierScheme":"ISNI","affiliationNameIdentifierURI":"http://www.isni.org/isni/"}],"affiliationNames":[{"affiliationName":"","affiliationNameLang":"ja"}]}],"creatorNames":[{"creatorName":"越智, 光一","creatorNameLang":"ja"},{"creatorName":"Ochi, Mitsukazu","creatorNameLang":"en"}],"familyNames":[{"familyName":"越智","familyNameLang":"ja"},{"familyName":"Ochi","familyNameLang":"en"}],"givenNames":[{"givenName":"光一","givenNameLang":"ja"},{"givenName":"Mitsukazu","givenNameLang":"en"}],"nameIdentifiers":[{"nameIdentifier":"26765","nameIdentifierScheme":"WEKO"},{"nameIdentifier":"30067748","nameIdentifierScheme":"e-Rad","nameIdentifierURI":"https://nrid.nii.ac.jp/ja/nrid/1000030067748"}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2019-05-23"}],"displaytype":"detail","filename":"KU-1100-20080207-01.pdf","filesize":[{"value":"454.8 kB"}],"format":"application/pdf","licensetype":"license_note","mimetype":"application/pdf","url":{"label":"KU-1100-20080207-01.pdf","url":"https://kansai-u.repo.nii.ac.jp/record/11506/files/KU-1100-20080207-01.pdf"},"version_id":"f7087575-8502-4ab0-b0bd-85787811610e"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"Epoxy nanocomposite","subitem_subject_scheme":"Other"},{"subitem_subject":"curing agent","subitem_subject_scheme":"Other"},{"subitem_subject":"filler dispersion method","subitem_subject_scheme":"Other"},{"subitem_subject":"space charge distribution","subitem_subject_scheme":"Other"},{"subitem_subject":"permittivity","subitem_subject_scheme":"Other"},{"subitem_subject":"conductivity","subitem_subject_scheme":"Other"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"eng"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"journal article","resourceuri":"http://purl.org/coar/resource_type/c_6501"}]},"item_title":"Dielectric properties of epoxy/clay nanocomposites : effects of curing agent and clay dispersion method (Final draft (Post-print) version)","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"Dielectric properties of epoxy/clay nanocomposites : effects of curing agent and clay dispersion method (Final draft (Post-print) version)"}]},"item_type_id":"9","owner":"1","path":["1597"],"pubdate":{"attribute_name":"公開日","attribute_value":"2012-02-04"},"publish_date":"2012-02-04","publish_status":"0","recid":"11506","relation_version_is_last":true,"title":["Dielectric properties of epoxy/clay nanocomposites : effects of curing agent and clay dispersion method (Final draft (Post-print) version)"],"weko_creator_id":"1","weko_shared_id":1},"updated":"2024-08-29T01:34:44.659455+00:00"}